Enterprise Wide PCB Design. CR-5000 is Zuken’s printed circuit board (PCB) and advanced packaging layout suite of customizable tools aimed at the Enterprise market. Incorporating the latest technology requirements (embedded components, RF Design & Design re-use) within a constrained design process methodology, it offers maximum benefit for customers whose key requirements include high. CR-5000 is Zuken’s most advanced modular and robust electronics systems and PCB design software. Created to manage the complete development and manufacturing preparation process on an enterprise-wide scale, Zuken's leading-edge PCB design software was developed specifically for medium to large organizations.
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- Size：2dvd
- Language：english
- Platform：Winxp/Win7
- Freshtime：2012-03-13
- Tag：ZukenCR5000 SD/BD v12download
The latest release of our most advanced design suite for electronics systems and PCBs CR-5000 revision 13 delivers a wide array of enhancements to help you streamline your design process. We have achieved sizeable performance gains in placement and routing, which accounts for 60% to 70% of PCB design work. Improvements in operability make design work more efficient. In addition to the features highlighted below, more information is available in the product release notes. Performance Faster processing for generating copper areas and automatic correction of copper areas as traces plow through or boundaries change. Faster display of filled copper areas and faster highlighting of nets with many pins connected. Faster design rule checking in both overall performance and rules by area. Related to this, you can now generate areas around components at narrow pitches, allowing higher design quality and density. Routing * support for intelligent objects - trunk routingSome of the routing technology from the Lightning high-speed design environment has been incorporated directly into the core functionality of Board Designer. Trunk routing allows you to handle multiple signals at the same time by grouping them together and routing them as a bundle. Automatic trace lengthening creates serpentine wiring for controlling the timing of high-speed signals. Manufacturability improvements to teardrop generationIn the Input Wire command, there is now automatic deletion of antenna patterns which may appear when a line is snapped to the middle of a trace. For automatic teardrop creation, you can now set a Min Width Ratio and connection target for teardrops in the Input Wire command. You can move embedded components between layers interactively. Package Design In the Bond Shell function, you can define multiple attach points in one pad. In Package DRC, you can now check the clearance between conductive patterns and bond wires in resist openings. Documentation Several new documentation features have been added including Text Frame Shapes for leaders, automatic assignments of drill chart symbols, and enhanced drill chart generation.
